共 2 条
- [1] A characterization study of direct imaging technique for stencil printing of thick boards (0.125") in the Alternative Assembly and Reflow Technology (AART) or Pin-in-Paste process TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, : 92 - 99
- [2] A study of solder paste rheology for the Alternative Assembly and Reflow Technology (AART) process ELECTRONIC PACKAGING MATERIALS SCIENCE X, 1998, 515 : 159 - 164