Evaluation study of ProFlow system for stencil printing of thick boards (0.125 inches) in the Alternative Assembly and Reflow Technology (AART) or Pin-in-Paste process

被引:0
作者
Manessis, D. [1 ]
Whitmore, M. [1 ]
Adriance, J.H. [1 ]
Westby, G.R. [1 ]
机构
[1] Universal Instruments Corp, Binghamton, United States
来源
National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East) | 1999年 / 1卷
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:416 / 422
相关论文
共 2 条
  • [1] A characterization study of direct imaging technique for stencil printing of thick boards (0.125") in the Alternative Assembly and Reflow Technology (AART) or Pin-in-Paste process
    Manessis, D
    Whitmore, M
    Adriance, JH
    Westby, GR
    TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, : 92 - 99
  • [2] A study of solder paste rheology for the Alternative Assembly and Reflow Technology (AART) process
    Murthy, ST
    Manessis, D
    Srihari, K
    Westby, GR
    ELECTRONIC PACKAGING MATERIALS SCIENCE X, 1998, 515 : 159 - 164