共 50 条
- [41] Simultaneous Double Side Grinding of Silicon Wafers: A Further Investigation into Grinding Marks Pattern CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2010 (CSTIC 2010), 2010, 27 (01): : 395 - 400
- [42] Fine grinding of silicon wafers: a mathematical model for the chuck shape INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2003, 43 (07): : 739 - 746
- [43] Simultaneous double side grinding of silicon wafers: a literature review INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2006, 46 (12-13): : 1449 - 1458
- [44] Warping of silicon wafers subjected to back-grinding process PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY, 2015, 40 : 87 - 93
- [45] Fine grinding of silicon wafers: a mathematical model for the wafer shape INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2004, 44 (7-8): : 707 - 716
- [46] A fundamental modeling approach for nano-grinding of silicon wafers PROGRESS ON ADVANCED MANUFACTURE FOR MICRO/NANO TECHNOLOGY 2005, PT 1 AND 2, 2006, 505-507 : 253 - 258
- [48] Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, 2017, 139 (08):
- [50] Fine grinding of silicon wafers: A mathematical model for the chuck shape 1600, 739-746 (May 2003):