共 50 条
- [1] Flat rates on future silicon wafers:: precision grinding INDUSTRIAL DIAMOND REVIEW, 2000, 60 (02): : 149 - +
- [2] Precision machining of future silicon wafers INITIATIVES OF PRECISION ENGINEERING AT THE BEGINNING OF A MILLENNIUM, 2001, : 411 - 415
- [3] Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2013, 66 : 54 - 65
- [4] A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-precision Grinding of Silicon Wafers ADVANCES IN ABRASIVE TECHNOLOGY XIII, 2010, 126-128 : 707 - 712
- [6] Fine grinding of silicon wafers INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2001, 41 (05): : 659 - 672
- [7] Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers ADVANCES IN ABRASIVE TECHNOLOGY XI, 2009, 389-390 : 36 - 41
- [8] Traverse grinding characteristics of resin bond diamond wheel with new profile in precision grinding of silicon wafers PROCEEDINGS OF: SILICON MACHINING: 1998 SPRING TOPICAL MEETING, 1998, : 40 - 43
- [9] A method for grinding mode identification in grinding of silicon wafers PRECISION SURFACE FINISHING AND DEBURRING TECHNOLOGY, 2007, 24-25 : 255 - 260