Analyses of sub-surface damages in quartz crystal wafers

被引：0
|
作者：
Li, Shi-Lan [1 ]
Bao, Sheng-Xiang [1 ]
Ma, Li-Li [1 ]
Peng, Jin [1 ]
Du, Zhi-Bo [1 ]
Zhou, Xun [1 ]
机构：
[1] State Key Lab. of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology, Chengdu 610054, China
来源：
Yadian Yu Shengguang/Piezoelectrics and Acoustooptics | 2008年 / 30卷 / 02期
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摘要：
Piezoelectricity quartz is the most commonly used substrate in single device. The machining process will bring surface/subsurface damage which will directly influences the performance, stability and life of electronic devices. In this paper, the surface damage layer in the quartz crystal wafer of 36°AT-Cut induced by Chemical-mechanical polishing was analyzed by means of scanning electron microscopy and X-ray rocking curve measurements after the wafer was chemically etched. The reason of formed damage layer and the influence of device performances was discussed in detail.
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页码：246 / 247
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