Fatigue crack propagation in lead-free solder under mode I and II loading

被引：0
|
作者：
Tanaka, Keisuke [1 ]
Iwata, Yoshifumi [1 ]
Akiniwa, Yoshiaki [1 ]
机构：
[1] Department of Mechanical Engineering, Meijo University, 1-501 Shiogamaguchi, Tempaku-ku, Nagoya-shi, Aichi, 468-8502, Japan
来源：
Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A | 2009年 / 75卷 / 760期
关键词：
D O I：
10.1299/kikaia.75.1738
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1738 / 1745
相关论文
共 50 条
  • [21] Mode I fatigue crack growth under biaxial loading
    Hamam, R
    Pommier, S
    Bumbieler, F
    INTERNATIONAL JOURNAL OF FATIGUE, 2005, 27 (10-12) : 1342 - 1346
  • [22] CRACK-PROPAGATION UNDER MODE-I AND MODE-II LOADING IN SLATE SCHIST
    LAQUECHE, H
    ROUSSEAU, A
    VALENTIN, G
    INTERNATIONAL JOURNAL OF ROCK MECHANICS AND MINING SCIENCES, 1986, 23 (05): : 347 - 354
  • [23] MODE-III AND MODE-I FATIGUE CRACK-PROPAGATION BEHAVIOR UNDER TORSIONAL LOADING
    TSCHEGG, EK
    JOURNAL OF MATERIALS SCIENCE, 1983, 18 (06) : 1604 - 1614
  • [24] Automated crack length measurement for fatigue crack propagation under mixed mode loading
    Plank, R
    Kuhn, G
    TECHNISCHES MESSEN, 1996, 63 (02): : 51 - 55
  • [25] Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads
    Kim, Ilho
    Lee, Soon-Bok
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 95 - +
  • [26] Fatigue crack propagation life analysis of solder joints under thermal cyclic loading
    Purdue Univ, Indianapolis, United States
    Theor Appl Fract Mech, 2 (157-164):
  • [27] Fatigue crack propagation life analysis of solder joints under thermal cyclic loading
    Pidaparti, RMV
    Song, X
    THEORETICAL AND APPLIED FRACTURE MECHANICS, 1996, 24 (02) : 157 - 164
  • [28] MODE II FATIGUE CRACK PROPAGATION
    ROBERTS, R
    KIBLER, JJ
    JOURNAL OF BASIC ENGINEERING, 1971, 93 (04): : 671 - +
  • [29] Fatigue crack growth - Mode I cycles with periodic Mode II loading
    Dahlin, P.
    Olsson, M.
    INTERNATIONAL JOURNAL OF FATIGUE, 2008, 30 (05) : 931 - 941
  • [30] Fatigue Properties of Lead-free Doped Solder Joints
    Su, Sinan
    Akkara, Francy John
    Abueed, Mohammed
    Jian, Minghong
    Hamasha, Sa'd
    Suhling, Jeff
    Lall, Pradeep
    PROCEEDINGS OF THE 17TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2018), 2018, : 1243 - 1248
12345