Current issues and future visions of system Jisso-CAD/CAE

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| 2012年 / Japan Institute of Electronics Packaging, 4F Toranomon Sangyo Bldg. 2-29, Toranomon 1-chome, Minato-ku, Tokyo, 105-0001, Japan卷 / 15期
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10.5104/jiep.15.5
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[No abstract available]
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页码：5 / 7
页数：2
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