Scaling behavior of internal stress in electrodeposited nickel thin films

被引：0
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作者：
Saitou, M. [1 ]
Oshiro, S. [1 ]
Sagawa, Y. [1 ]
机构：
[1] Department of Mechanical Systems Engineering, University of the Ryukyus, 1 Senbaru Nishihara-cho, Okinawa, 903-0213, Japan
来源：
Journal of Applied Physics | 2008年 / 104卷 / 09期
关键词：
We have investigated the effects of the current density; film thickness; temperature; and additive agent on the internal stress in electrodeposited nickel thin films using a bent strip measurement. The internal stress is found to obey a scaling law expressed in terms of the current density and film thickness. The additive agent is shown to behave as a noise leading to different exponents in the dynamic scaling theory. In addition; the Arrhenius temperature dependence of the internal stress indicates the presence of thermal activation related to grain growth. © 2008 American Institute of Physics;
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