Establishment of estimate methods on impact strength of lead-free solder joints in BGA packages (2) study of estimate methods on impact strength of solder joints by interfacial stress

被引：0

作者：

Yaguchi A. ^{[1
]}

Tanie H. ^{[1
]}

Naka Y. ^{[1
]}

Yamamoto K. ^{[2
]}

Kimoto R. ^{[2
]}

Ohno N. ^{[3
]}

机构：

[1] Mechanical Engineering Research Laboratory, Hitachi, Ltd., Hitachinaka-shi, Ibaraki 312-0034

[2] Production and Technology Unit, Renesas Electronics Corp., Kodaira-shi, Tokyo 187-8588

[3] Department of Mechanical Engineering, Nagoya University, Chikusa-ku, Nagoya-shi, Aichi 464-8603, Furo-cho

来源：

Journal of Japan Institute of Electronics Packaging | 2010年 / 13卷 / 06期

关键词：

Ball grid array; FEM; Interfacial stress; Lead-free solder; Solder joints; Strain rate;

D O I：

10.5104/jiep.13.453

中图分类号：

学科分类号：

摘要：

This paper describes a method to estimate the impact strength of lead-free solder joints in Ball Grid Array (BGA) packages based on the interfacial stresses on the solder joints. The impact strength of the solder joints strongly depends on the strain rate of the solder, which correlates with strain pulse durations in a Printed Wiring Board (PWB). To adopt the dependence of the strain rate of a solder to a Finite Element Method (FEM) analysis, the stress-strain properties of the lead-free solder were measured at a high strain rate. When the impact strength of the lead-free solder joints was explained by the stress of solder joint interfaces, the strength could be estimated without consideration of the dependence of the strain pulse duration of the PWB.

引用

页码：453 / 461

页数：8

共 6 条

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