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- [1] THE SIGNAL INTEGRITY SIMULATION OF SIP PACKAGE USING TSV INTERPOSER TECHNOLOGY 2018 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2018,
- [2] Wafer Level Packaging of RF MEMS Devices Using TSV Interposer Technology PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 231 - 235
- [4] Silicon Interposer and TSV Signaling 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 266 - 275
- [5] Design and process technology for High Q integrated inductor on interposer with TSV 2018 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT2018), 2018,
- [6] Assembly Process Simulation of TSV Interposer 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 234 - +
- [8] An Equivalent Model of TSV Silicon Interposer 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 582 - 586
- [9] Homogenization Schemes for TSV Interposer Packages 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 698 - 702
- [10] Post TSV Etch Cleaning Process Development using SAPS Megasonic Technology 3D/TSV/ Interposer: Through Silicon Via and Packaging 2015 26TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2015, : 201 - 203