High-performance flip-chip BGA technology based on thin-core and coreless package substrate

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Fujitsu Limited, Kawasaki 211-8588, Japan [1 ]
不详 [2 ]
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J. Jpn. Inst. Electron. Packag. | 2008年 / 3卷 / 212-216期
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D O I：
10.5104/jiep.11.212
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