共 31 条
- [1] Aabrar K. A., 2023, 2023 International Electron Devices Meeting (IEDM), P1
- [2] Alon E., 2008, IEEE J SOLID-ST CIRC, V43, P1807
- [4] Deng Sunbin, 2024, 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), P1, DOI 10.1109/VLSITechnologyandCir46783.2024.10631422
- [5] Deng S., 2023, IEDM, P1, DOI [10.1109/iedm45741.2023.10413838, DOI 10.1109/IEDM45741.2023.10413838]
- [6] Metal-insulator-metal capacitors using atomic-layer-deposited Al2O3/HfO2/Al2O3 sandwiched dielectrics for wireless communications [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2006, 24 (06): : 2518 - 2522