Study on three-level matching model of product configuration oriented to mass customization

被引：0

作者：

Ge, Jiang-Hua ^{[1
,2
]}

Xu, Yong-Lin ^{[2
]}

Huang, Yong-Tao ^{[2
]}

Gao, Guo-An ^{[1
]}

机构：

[1] Mechanical Electron Engineering College, Harbin Institute of Technology

[2] Contemporary Manufacturing Engineering and Cutter Exploitation Laboratory, Harbin University of Science and Technology

来源：

Key Engineering Materials | 2009年 / 407-408卷

关键词：

Correlation matching; Correlation matrix; Mass customization; Product configuration; Three-level matching model;

D O I：

10.4028/www.scientific.net/KEM.407-408.257

中图分类号：

学科分类号：

摘要：

This paper proposed configuration three-level matching model based on modular product structure in order to solve the product configuration design problem in mass customization (MC). According to the product structure and the features of configurtion design, the model divided the configuration course into three parts as first-level complete matching, second-level similarity matching and third-level correlation matching. Firstly obtained standard module that meets clients'demands by retrieval algorithm of first-level complete matching and similar module of the customized by mathematical model of second-level similarity matching. Then based on them, analyzed the correlation matrix among modules and associated attributes of modules interface, and established the mathematical model of third-level correlation matching and realized the optimum combination of modules. Finally, verified the model by examples. The results indicate that this model could effectively solve the low-efficiency problem of deformation module recombination design in traditional product configuration so to rapidly respond to clients' customization demands. © (2009) Trans Tech Publications.

引用

页码：257 / 263

页数：6

共 6 条

[1]

LIU F., LI S.X., Et al., Chinese Journal of Mechanical Engineering, 40, 1, pp. 109-113, (2004)

[2]

LOU J.R., YI G.D., Et al., Journal of Zhejiang University: Engineering Science, 40, 6, pp. 466-470, (2006)

[3]

ZHANG J.J., ZHANG J.C., Et al., Computer Integrated Manufacturing Systems, 13, 1, pp. 44-48, (2007)

[4]

ZHONG S.S., LI J., Et al., Journal of Harbin Institute of Technology, 35, 12, pp. 1461-1464, (2003)

[5]

GE J.H., WANG Y.P., Et al., Key Engineering Materials, 392-394, pp. 661-666, (2009)

[6]

ZHONG S.S., LI F.J., Et al., Computer Integrated Manufacturing Systems, 6, 2, pp. 70-74, (2000)

← 1 →