3D technology with application to high bandwidth and processor-memory modules

被引：0
|
作者：
机构：
[1] Baez, Franklin
[2] Shapiro, Mike
[3] Farooq, Mukta
[4] Berger, Dan
[5] Iyer, Subramani
来源：
| 1600年 / IMAPS-International Microelectronics and Packaging Society卷 / 40期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] Processor Architecture Design Using 3D Integration Technology
    Xie, Yuan
    23RD INTERNATIONAL CONFERENCE ON VLSI DESIGN, 2010, : 446 - 451
  • [22] Technology and application of 3D interconnect
    Jones, Robert E.
    Chatterjee, Ritwik
    Pozder, Scott
    2007 IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUIT DESIGN AND TECHNOLOGY, PROCEEDINGS, 2007, : 176 - +
  • [23] APPLICATION OF NEW 3D TECHNOLOGY
    KARLSSON, T
    OIL & GAS JOURNAL, 1986, 84 (44) : 46 - &
  • [24] Versatile stream buffer architecture to exploit the high memory bandwidth of 3-D IC technology
    Lim, Hong-Yeol
    Park, Gi-Ho
    IEICE ELECTRONICS EXPRESS, 2013, 10 (04):
  • [25] H3DM: A High-bandwidth High-capacity Hybrid 3D Memory Design for GPUs
    Akbarzadeh, Negar
    Darabi, Sina
    Gheibi-Fetrat, Atiyeh
    Mirzaei, Amir
    Sadrosadati, Mohammad
    Sarbazi-Azad, Hamid
    PROCEEDINGS OF THE ACM ON MEASUREMENT AND ANALYSIS OF COMPUTING SYSTEMS, 2024, 8 (01)
  • [26] Reduce the memory bandwidth of 3D graphics hardware with a novel rasterizer
    Chen, CH
    Lee, CY
    JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, 2002, 11 (04) : 377 - 391
  • [27] Modeling and Simulation of a High Bandwidth Conical 3D Monopole Antenna for 3D IC
    Wang, Yang
    Ju, Yudi
    Liu, Ziyu
    Sun, Qingqing
    Chen, Lin
    Zhang, David Wei
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [28] Guest Editor' Introduction: Design & Test of a High-Volume 3-D Stacked Graphics Processor With High-Bandwidth Memory
    Marinissen, Erik Jan
    Zorian, Yervant
    IEEE DESIGN & TEST, 2017, 34 (01) : 6 - 7
  • [29] Vertical 3D NAND Flash Memory Technology
    Nitayama, Akihiro
    Aochi, Hideaki
    ULSI PROCESS INTEGRATION 7, 2011, 41 (07): : 15 - 25
  • [30] 3D SiP Simulation Technology and Application
    Suny Li
    ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
12345