Numerical simulation of thermocapillary convection in detached solidification under cusp magnetic field

被引：0
|
作者：
Peng, Lan [1 ]
Gong, Huan [1 ]
Li, You-Rong [1 ]
Tu, Jing-Yi [1 ]
Yu, Xin [2 ]
机构：
[1] Key Laboratory of Low-grade Energy Utilization Technologies and Systems of Ministry of Education, College of Power Engineering, Chongqing University, Chongqing 400044, China
[2] Chongqing Tongcheng Engineering Consult and Design Co., Ltd., Utilities Department, Chongqing 400023, China
来源：
Gongneng Cailiao/Journal of Functional Materials | 2014年 / 45卷 / 01期
关键词：
D O I：
10.3969/j.issn.1001-9731.2014.01.011
中图分类号：
学科分类号：
摘要：
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收藏
页码：01049 / 01054
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