Functionalization of boron nitride with poly(catechol-polyamine) and bis(γ-triethoxysilylpropyl)tetrasulfide for preparing epoxy nanocomposites with enhanced thermal conductivity

被引:10
作者
Wu, Zijian [1 ,2 ,3 ,4 ]
Yang, Changjie [1 ]
Gao, Shunying [1 ]
Gao, Junguo [2 ,3 ]
Almalki, Abdulraheem S. A. [5 ]
Fallatah, Ahmed M. [5 ]
Ren, Juanna [4 ,6 ]
Ibrahim, Mohamed M. [5 ]
Guo, Ning [3 ]
Zhao, Wei [1 ]
Weng, Ling [1 ,3 ]
Guo, Zhanhu [4 ]
El-Bahy, Zeinhom M. [7 ]
机构
[1] Harbin Univ Sci & Technol, Sch Mat Sci & Chem Engn, Harbin 150040, Peoples R China
[2] Xi An Jiao Tong Univ, State Key Lab Elect Insulat & Power Equipment, Xian 710049, Peoples R China
[3] Harbin Univ Sci & Technol, Key Lab Engn Dielect & Its Applicat Technol, Minist Educ, Harbin 150040, Peoples R China
[4] Northumbria Univ, Fac Engn & Environm, Mech & Construct Engn, Newcastle Upon Tyne NE1 8ST, England
[5] Taif Univ, Coll Sci, Dept Chem, POB 11099, At Taif 21944, Saudi Arabia
[6] Taiyuan Univ Sci & Technol, Coll Mat Sci & Engn, Taiyuan 030024, Peoples R China
[7] Al Azhar Univ, Fac Sci, Dept Chem, Nasr City 11884, Cairo, Egypt
关键词
CARBON NANOTUBES COMPOSITE; POLYMER COMPOSITE; NANOSHEETS; BN; NETWORKS; FILMS;
D O I
10.1007/s10854-024-13657-3
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Hexagonal boron nitride (hBN) has garnered significant interest as inorganic thermally conductive material in electronic packaging due to its high-efficiency thermal management capability and electrical insulation properties. However, the relatively inert chemical environment of the BN surface hinders phonon transfer at the interface. Additionally, the high content of inorganic components in the matrix leads to the deterioration of the composite's mechanical properties. In this research, h-BN surface is modified using poly(catechol-polyamine) (PCPA) and bis (gamma-triethoxysi-lylpropyl)tetrasulphide (Si69) (denoted as BN-PCPA-Si69). The noncovalent PCPA modification protects the endothermic properties of BN, Si69 provides covalent bonding between thermally conductive fillers and bisphenol A-type epoxy resin (Ep), and the interfacial compatibility between BN and epoxy resin is improved. The heat conductivity of final BN/Ep composite achieved 0.817 W/(m<middle dot>K) containing 30 wt% BN. Correspondingly, the heat conductivity of the composite (mBN/Ep) achieved 0.881 W/(m<middle dot>K) containing 30 wt% BN-PCPA-Si69. Compared to pure epoxy resin (0.200 W/(m<middle dot>K), the thermal conductivity (TC) of the mBN/Ep composite increased by 364% while maintaining good electrical insulation properties. The proposed BN surface functionalization approach has potential applications in fields such as microelectronic packaging, where materials need to balance high thermal conductivity and electrical insulation.
引用
收藏
页数:12
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