Preparation and thermal property analysis of Ag-Cu-In-Sn nano-powder

被引：0

作者：

Yan, Xiuwen ^{[1
,2
]}

Qiu, Tai ^{[2
]}

Li, Liangfeng ^{[2
]}

Zhang, Zhenzhong ^{[2
]}

机构：

[1] No.48st Research Institute, China Electronics Technology Group Corporation, Changsha 410111, China

[2] Nanjing University of Technology, Nanjing 210009, China

来源：

Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering | 2008年 / 37卷 / 02期

关键词：

Copper alloys - Differential scanning calorimetry - Indium alloys - Melting point - Nanostructured materials - Particle size - Thermodynamic properties - Thermogravimetric analysis - Tin alloys - Transmission electron microscopy - X ray diffraction analysis;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Chain shaped, well dispersal and nano-scale Ag-Cu-In-Sn powders were successfully prepared by DC arc plasma method. The structure, particle size and thermal properties were studied by XRD, TEM and TG-DSC. Results show that Ag-Cu-In-Sn powder with 45.03 nm particle size and homogeneous distribution can be produced by the optimized process. The powder has its unique thermal performance, and its melting point decreases by about 160°C compared with that of micro-scale powder.

引用

页码：330 / 333