Device-level vacuum packaging of silicon microgyroscopes

被引：3

作者：

Shi, Qin ^{[1
]}

Ding, Rongzheng ^{[2
]}

Su, Yan ^{[1
]}

Qiu, Anping ^{[1
]}

机构：

[1] Ministerial Key Laboratory of ZNDY, Nanjing University of Science and Technology

[2] Wuxi Zhongwei High Technology Electronics Co. Ltd.

来源：

Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2009年 / 45卷 / 02期

关键词：

Degassing process; Device-level vacuum packaging; Quality factor; Silicon microgyroscopes;

D O I：

10.3901/JME.2009.02.243

中图分类号：

学科分类号：

摘要：

The device-level vacuum packaging technologies of silicon microgyroscopes are studied in order to carry out vacuum packaging of silicon microgyroscopes to improve performance of microgyroscopes. First, the special ceramic packages for silicon microgyroscopes are designed and the soldering sealing technology is adopted. The alloy An/St is adopted to cater for the high temperature in the packaging process. The effects of degassing process on the quality factor of silicon microgyroscopes are studied, and the results of degassing experiments show that the quality factor of silicon microgyroscopes can be effectively improved when the silicon microgyroscopes chips and ceramic packages are baked in vacuum chamber. The device-level vacuum packaging process is established. The quality factor of packaged silicon microgyroscopes is about 10363.7, which is about fifty times of quality factor of silicon microgyroscopes under ambient atmosphere pressure. The tracking test results of quality factor of silicon microgyroscope show that after the vacuum packaged silicon microgyrscopes are stored for five months, their quality factor is reduced to 55.1% of the original value, which shows that the vacuum retentivity of silicon microgyroscopes packaged with device-level vacuum packaging technology is poor and needs further study.

引用

页码：243 / 246

页数：3

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