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- [5] Influence of indium on wetting behaviors of Sn-8Zn-3Bi lead-free solders Xiyou Jinshu Cailiao Yu Gongcheng, 2006, 4 (613-616):
- [8] Effect of Epoxy Flux Underfill on Thermal Cycling Reliability of Sn-8Zn-3Bi Lead-Free Solder in a Sensor Application 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 2169 - 2175
- [9] Temperature and Flux Effect on Contact Angles and Intermetallic between Sn-8Zn-3Bi Lead-free Solder and Cu Substrate SAINS MALAYSIANA, 2009, 38 (03): : 395 - 400