Achieving optimum adhesion of conductive adhesive bonded flip-chip on flex packages

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作者：

Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong ^{[1
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来源：

Rev. Adv. Mater. Sci. | 2009年 / 2卷 / 165-172期

关键词：

Flip chip devices - Packaging materials - Technology transfer - Chip scale packages - Conductive materials;

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摘要：

Anisotropic conductive adhesives film (ACF) is a thermosetting epoxy matrix impregnated with small amount of electrically conductive particles and used as an interconnect materials for flip chip on flex (FCOF) packages. However, it remains a challenge to develop the reliable packaging know-how in processing of ACF materials. Considerable research has been conducted recently to investigate the effect of different parameters on the performances. One of the main reliability factors in characterizing the performance of ACF joints is adhesion strength. This review article will discuss the critical issues that can easily control the adhesion of ACF joints in flip chip on flex packages. These mainly include surface cleanliness, bonding tracks, process parameters, and operating environmental related issues. The findings can serve as a guide for optimizing the process parameters in the packaging of flip chip on flex with ACF. By preventing the usual degradation, the manufacturer can easily proceed for mass commercialization of ACF as an environmental friendly solder replacement in the electronic packaging industry. © 2009 Advanced Study Center Co. Ltd.

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