机构:
School of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, ChinaSchool of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, China
Ren, Bingyan
[1
]
Chu, Shijun
论文数: 0引用数: 0
h-index: 0
机构:
School of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, ChinaSchool of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, China
Chu, Shijun
[1
]
Wu, Xin
论文数: 0引用数: 0
h-index: 0
机构:
School of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, ChinaSchool of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, China
Wu, Xin
[1
]
Yu, Jianxiu
论文数: 0引用数: 0
h-index: 0
机构:
School of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, ChinaSchool of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, China
Yu, Jianxiu
[1
]
Sun, Xiuju
论文数: 0引用数: 0
h-index: 0
机构:
School of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, ChinaSchool of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, China
Sun, Xiuju
[1
]
机构:
[1] School of Material Science and Engineering, Hebei University of Technology, Tianjin 300130, China
来源:
Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors
|
2008年
/
29卷
/
09期
By modifying the guide system, with the help of the numerical simulation, the argon flow field and the total thermal field are obtained. We find that using the guide shell and the cooling cover improves the argon flow field, the solid-liquid interface, and the temperature gradient. It is good for the emanatory of crystallization latent heat and the improvement of the radical resistivity in the crystal. It also clarifies the mechanism of the improvement of the temperature gradient and the crystallization latent heat emanation velocity by improving the guide system.