Dynamic compressive properties of lead-free solder

被引：0

作者：

Niu, Xiao-Yan ^{[1
]}

Li, Zhi-Gang ^{[1
]}

Yuan, Guo-Zheng ^{[1
]}

Shu, Xue-Feng ^{[1
]}

机构：

[1] Institute of Applied Mechanics and Biomedical Engineering, Taiyuan University of Technology

来源：

Journal of Shanghai Jiaotong University (Science) | 2008年 / 13卷 / SUPPL.期

关键词：

Constitutive relation; Dynamic properties; Lead-free solders; Split Hopkinson pressure bar (SHPB); Strain-rate effect;

D O I：

10.1007/s12204-008-0874-1

中图分类号：

学科分类号：

摘要：

The quasi-static and dynamic compressive properties of lead-free solders were assessed. Dynamic experiments were conducted using a split Hopkinson pressure bar (SHPB) system at strain rates ranging from 500 to 2000 s-1. It was found that the lead-free solder 96.3Sn3Ag0.7Cu was sensitive to strain rates, its yield strength and flow stress increased remarkably with the increase of strain rate. Furthermore, Johnson-Cook material model was used to estimate visco-plastic behavior and strain rate sensitivity of the solder. The related parameters in the model were determined according to experimental results. Compared with the typical Pb-containing solder 63Sn37Pb, the lead-free solder showed some perfect properties and could be used to substitute some Pb-containing solder in microelectronic components packaging and interconnects.

引用

页码：74 / 77

页数：3

共 15 条

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