Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

被引：0

作者：

Sun, Peng ^{[1
,3
]}

Andersson, Cristina ^{[3
]}

Wei, Xicheng ^{[1
]}

Cheng, Zhaonian ^{[3
]}

Shangguan, Dongkai ^{[2
]}

Liu, Johan ^{[1
,3
]}

机构：

[1] Key State Laboratory for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, 200072 Shanghai, China

[2] Flextronics International, San Jose, CA, United States

[3] Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 Göteborg, Sweden

来源：

Journal of Alloys and Compounds | 2007年 / 437卷 / 1-2期

关键词：

In this paper; the coupling effect in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi solder joint with sandwich structure by long time reflow soldering was studied. It was found that the interfacial compound at the Cu substrate was binary Cu-Sn compound in Sn-Ag-Bi solder joint and Cu5Zn8 phase in Sn-Zn-Bi solder joint. The thickness of the Cu-Zn compound layer formed at the Cu substrate was greater than or equal to that of Cu-Sn compound layer; although the reflow soldering temperature of Sn-Zn-Bi (240 °C) was lower than that of Sn-Ag-Bi (250 °C). The stable Cu-Zn compound was the absolute preferential phase in the interfacial layer between Sn-Zn-Bi and the Cu substrate. The ternary (Cu; Ni)6Sn5 compound was formed at the Sn-Ag-Bi/Ni(P)-Cu metallization interface; and a complex alloy Sn-Ni-Cu-Zn was formed at the Sn-Zn-Bi/Ni(P)-Cu metallization interface. It was noted that Cu atoms could diffuse from the Cu substrate through the solder matrix to the Ni(P)-Cu metallization within 1 min reflow soldering time for both solder systems; indicating that just 30 s was long enough for Cu to go through 250 μm diffusion length in the Sn-Ag-Bi solder joint at 250 °C. The coupling effect between Ni(P)/Cu metallization and Cu substrate was confirmed as the type of IMCs at Ni(P) layer had been changed from Ni-Sn system to Cu-Sn system apparently by the diffusion effect of Cu atoms. The (Cu; Ni)6Sn5 layer at the Ni(P)/Cu metallization grew significantly and its thickness was even greater than that of the Cu-Sn compound on the opposite side; however the growth of the complex alloy including Sn; Ni; Cu and Zn on the Ni(P)/Cu metallization was suppressed. © 2006 Elsevier B.V. All rights reserved;

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摘要：

Journal article (JA)

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页码：169 / 179