SelectConnect™ process for metallizing circuits on molded parts and components

被引：2

作者：

MacAry R.L. ^{[1
]}

Hamilton R. ^{[2
]}

机构：

[1] Arlington Plating Company, Palatine, IL

[2] Molded Interconnect Devices, Macdermid, Waterbury, CT

来源：

Metal Finishing | 2010年 / 108卷 / 03期

关键词：

D O I：

10.1016/S0026-0576(10)00016-4

中图分类号：

学科分类号：

摘要：

SelectConnect Technologies has created three-dimensional molded interconnect device (3D-MID) by first molding a component from thermoplastic resin doped with an organometallic material. Circuit layouts are patterned on the molded component with a process called Laser Direct Structuring (LDS), using a laser beam from the LPKF Microline 3D laser system to create the desired circuit paths. The significant benefit of the LDS process is the design freedom from utilizing injection molded thermoplastics as the base of the device. Electroless plating is the method for forming electromechanical traces on the laser defined structure or the doubleshot-molded component. The sequence includes electroless copper plating (100 to 600 micro inches), electroless nickel plating (50 to 100 micro inches), and immersion gold plating (3 to 8 micro inches). Several applications for 3D-MID include IV regulators, laptop antennas, automated pipets, glucose meter, and dental tools.

引用

页码：35 / 37

页数：2