Molecular dynamic study of initial stage of micro-crack formation of metal films

被引：0

作者：

Jiang, Wenquan ^{[1
,2
]}

Du, Guangyu ^{[1
]}

Ba, Dechun ^{[1
]}

Yang, Fan ^{[2
]}

Zha, Yingying ^{[1
]}

机构：

[1] School of Mechanical Engineering and Automation, Northeastern University

[2] School of Mechwiieal Engineering, Uaoning Shikua University

来源：

Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology | 2013年 / 33卷 / 09期

关键词：

LAMMPS simulation; Metal film; Micro-crack; Molecular dynamics;

D O I：

10.3969/j.issn.1672-7126.2013.09.01

中图分类号：

学科分类号：

摘要：

The initial stage of the micro-crack formation, as exemplified by the copper film growth under a continuous loading, were physically modeled,numerically simulated with LAMMPUS simulation code,and theoretically studied on the basis of molecular dynamics. The stress-strain curve along the stretching direction in the copper film with point defects was derived. Hie simulated results show that the motion of copper atoms considerably affects the overall mechanical behavior of the copper film, and that the continuous loading results in the formation of an increased dislocations around the point defect, initializing the formation and growth of the micro-cracks on the surface of the copper film.

引用

页码：849 / 852

页数：3

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