Study of mechanical polishing of CVD diamond thick films

被引:0
|
作者
Yan, Zhaohui [1 ]
Wang, Jianhua [1 ]
Man, Weidong [1 ]
Xiong, Jun [1 ]
机构
[1] Province Key Laboratory of Plasma Chemical and Advanced Materials, Wuhan Institute of Technology, Wuhan 430073, China
来源
Jingangshi yu Moliao Moju Gongcheng/Diamond and Abrasives Engineering | 2007年 / 03期
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摘要
Diamond films prepared by Chemical Vapor Deposition (CVD) usually have a very rough surface and uneven thickness and should be polished before application. In this paper, we investigated the polishing effects of CVD diamond films using different sizes diamond powder and introduced a high quality and efficient polishing method, that is to polish the CVD diamond film first with diamond powder of W40 and W28 for 2 hours, then continue the polishing with diamond powder of W0.5 for 4 hours. The Scanning Electron Microscope (SEM) and Atomic Force Microscopy (AFM) test results of the polished diamond film show that the average removal rate of the diamond film is 12.2 μm/h and the surface roughness is decreased from 4.60 μm to 3.06 nm by this method. The experiment results also show that it's a high quality and efficient polishing method for CVD diamond films.
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页码:32 / 35
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