Area-selective post-deposition annealing process using flash lamp and Si photoenergy absorber for metal/high-k gate metal-insulator-semiconductor field-effect transistors with NiSi source/drain

被引:0
作者
Matsuki, Takeo [1 ]
Nishimura, Isamu [1 ,2 ]
Akasaka, Yasushi [1 ]
Hayashi, Kiyoshi [1 ,3 ]
Noguchi, Masataka [1 ,4 ]
Yamashita, Koji [1 ,5 ]
Torii, Kazuyoshi [1 ,6 ]
Kasai, Naoki [1 ,4 ]
Nara, Yasuo [1 ]
机构
[1] Research Department 1, Semiconductor Leading Edge Technologies, Inc., 16-1 Onogawa, Tsukuba, Ibaraki 305-8569, Japan
[2] ROHM Co., Ltd., 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan
[3] Renesas Technology Corp., Marunouchi Bldg., 4-1 Marunouchi 2-chome, Chiyoda-ku, Tokyo 100-6334, Japan
[4] NEC Corp., 7-1 Shiba 5-chome, Minato-ku, Tokyo 108-8001, Japan
[5] Tokyo Electron Ltd., TBS Broadcast Center, 3-6 Akasaka 5-chome, Minato-ku, Tokyo 107-8481, Japan
[6] Hitachi, Ltd., 6-6 Marunouchi 1-chome, Chiyoda-ku, Tokyo 100-8280, Japan
来源
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 2006年 / 45卷 / 4 B期
关键词
We have proposed an area-selective post-deposition annealing (PDA) process that involves a combination of flash lamp annealing and the use of a Si photoenergy absorber (Si-PEA) for metal/high-k gate last metal-insulator- semiconductor field-effect transistors (MISFETs) with NiSi on source/drain (S/D). The process makes it possible to suppress the increase in both the sheet resistance and junction leakage current of NiSi S/D regions. This PDA process also showed optimality for silicide gate electrode formation with silicidation of part of the Si-PEA. It was found that the flash lamp PDA with Si-PEA on nickel-silicide/HfAlOx/SiO2 gate-last MISFETs reduced electron trapping at the gate dielectric and resulted in better PBTI immunity than conventional rapid thermal PDA and flash lamp PDA without Si-PEA. © 2006 The Japan Society of Applied Physics;
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页码:2939 / 2944
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