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- [2] Microstructural evolution and mechanical properties of Sn-Bi-Cu ternary eutectic alloy produced by directional solidification MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, 2018, 21 (02):
- [7] Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints Journal of Materials Science: Materials in Electronics, 2000, 11 : 609 - 618
- [8] Study of Sn-Bi-Cu Lead-free Solder EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 1375 - 1380