共 50 条
[41]
Assembly process and solder joint integrity of the Metal Ball Grid Array (MBGA) package
[J].
Proceedings - Electronic Components and Technology Conference,
1996,
:1265-1270
[46]
Cheap as chips: An accessible chip off acquisition method for ball grid array (BGA) integrated circuits in digital investigations
[J].
FORENSIC SCIENCE INTERNATIONAL-DIGITAL INVESTIGATION,
2022, 42-43
[47]
Flex Tape Ball Grid Array
[J].
46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS,
1996,
:1271-1277
[48]
SnAgCu micro-ball grid array (BGA) solder joint evaluation using a torsion mechanical fatigue test method
[J].
ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C,
2005,
:1223-1228
[49]
Solder joint reliability challenges in sub 1.00MM ball pitch for flip chip ball grid array
[J].
Advances in Electronic Packaging 2005, Pts A-C,
2005,
:1449-1454