Integrated life prediction method of ball grid array soldered joint

被引:0
作者
Chen, Ying [1 ]
Kang, Rui [1 ]
机构
[1] Department of System Engineering of Engineering Technology, Beijing University of Aeronautics and Astronautics, Beijing 100191, China
来源
Hanjie Xuebao/Transactions of the China Welding Institution | 2009年 / 30卷 / 11期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:105 / 108
相关论文
共 50 条
[31]   TEST METHOD TO EVALUATE A ROBUST BALL GRID ARRAY (BGA) BALL MOUNT FLUX [J].
Chou, Sheng-Hung ;
Liu, Yan ;
Durham, Maria ;
Lim, Sze Pei ;
Fang, Te-Hua ;
Hsiao, Yu-Jen .
PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, :623-628
[32]   Ball grid array solder joint failure envelope development for dynamic loading [J].
Shah, KR ;
Mello, M .
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, :1067-1074
[33]   Ball Grid Array (BGA) solder joint intermittency detections: SJ BIST [J].
Hofmeister, James P. ;
Lall, Pradeep ;
Panchagade, Dhananjay ;
Roth, Norman N. ;
Tracy, Terry A. ;
Judkins, Justin B. ;
Harris, Kenneth L. .
2008 IEEE AEROSPACE CONFERENCE, VOLS 1-9, 2008, :3847-+
[34]   The influence of pad geometry on ceramic ball grid array solder joint reliability [J].
Yee, S ;
Ladhar, H .
NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM, 1996, :267-273
[35]   Warpage Resolution for Ball Grid Array (BGA) Package in a Fully Integrated Assembly [J].
Denoyo, Alvin B. .
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, :418-421
[36]   Prediction of Remaining Useful Life (RUL) of Ball-Grid-Array (BGA) Interconnections during Testing on the Board Level [J].
Gucik-Derigny, David ;
Zolghadri, Ali ;
Bechou, Laurent ;
Suhir, Ephraim .
2014 IEEE AEROSPACE CONFERENCE, 2014,
[37]   Position Determination of A Ball Grid Array by Automated Optical Inspection Method [J].
Lin, Yi-Chuan ;
Wang, Kerwin .
2014 9TH IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS), 2014, :97-101
[38]   A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn-Ag-Cu Ball-Grid-Array Packages [J].
Dauksher, Walter ;
Lau, John .
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2009, 9 (02) :231-236
[39]   Solder joint reliability of cavity-down plastic ball grid array assemblies [J].
Lee, SWR ;
Lau, JH .
SOLDERING & SURFACE MOUNT TECHNOLOGY, 1998, 10 (01) :26-+
[40]   Assembly process and solder joint integrity of the Metal Ball Grid Array (MBGA) package [J].
Tostado, S. ;
Chow, J. .
Proceedings - Electronic Components and Technology Conference, 1996, :1265-1270