共 50 条
[31]
TEST METHOD TO EVALUATE A ROBUST BALL GRID ARRAY (BGA) BALL MOUNT FLUX
[J].
PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC),
2016,
:623-628
[32]
Ball grid array solder joint failure envelope development for dynamic loading
[J].
54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS,
2004,
:1067-1074
[33]
Ball Grid Array (BGA) solder joint intermittency detections: SJ BIST
[J].
2008 IEEE AEROSPACE CONFERENCE, VOLS 1-9,
2008,
:3847-+
[34]
The influence of pad geometry on ceramic ball grid array solder joint reliability
[J].
NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM,
1996,
:267-273
[35]
Warpage Resolution for Ball Grid Array (BGA) Package in a Fully Integrated Assembly
[J].
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012),
2012,
:418-421
[36]
Prediction of Remaining Useful Life (RUL) of Ball-Grid-Array (BGA) Interconnections during Testing on the Board Level
[J].
2014 IEEE AEROSPACE CONFERENCE,
2014,
[37]
Position Determination of A Ball Grid Array by Automated Optical Inspection Method
[J].
2014 9TH IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS),
2014,
:97-101
[40]
Assembly process and solder joint integrity of the Metal Ball Grid Array (MBGA) package
[J].
Proceedings - Electronic Components and Technology Conference,
1996,
:1265-1270