Integrated life prediction method of ball grid array soldered joint

被引:0
作者
Chen, Ying [1 ]
Kang, Rui [1 ]
机构
[1] Department of System Engineering of Engineering Technology, Beijing University of Aeronautics and Astronautics, Beijing 100191, China
来源
Hanjie Xuebao/Transactions of the China Welding Institution | 2009年 / 30卷 / 11期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:105 / 108
相关论文
共 50 条
[21]   Plastic ball grid array solder joint reliability for avionics applications [J].
Qi, Haiyu ;
Osterman, Michael ;
Pecht, Michael .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (02) :242-247
[22]   Electric current effect on microstructure of ball grid array solder joint [J].
Wu, BY ;
Chan, YC .
JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 392 (1-2) :237-246
[23]   Electric current effect on microstructure of ball grid array solder joint [J].
Chan, Y.C. (eeycchan@cityu.edu.hk), 1600, Elsevier Ltd (392) :1-2
[24]   Investigation and prediction of solder joint failure analysis for ball grid array package subject to mechanical bending environment [J].
Wu, Mei-Ling ;
Lan, Jia-Shen .
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2017, 29 (02) :75-84
[25]   Influence of Ball Grid Array Design Parameters on Solder Joint Reliability [J].
Afripin, Amirul ;
Hauck, Torsten .
2022 IEEE 39TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2022,
[26]   Study on solder joint reliability of ceramic ball grid array component based on design of experiment method [J].
吴兆华 ;
黄春跃 ;
周德俭 .
China Welding, 2006, (03) :68-73
[27]   Failure analysis on soldered ball grid arrays: Part i [J].
Vogel, Gert .
Electronic Device Failure Analysis, 2017, 19 (01) :4-8
[28]   Shape prediction and reliability design of ball grid array solder joints [J].
Tian, Yanhong ;
Wang, Chunqing .
PROGRESSES IN FRACTURE AND STRENGTH OF MATERIALS AND STRUCTURES, 1-4, 2007, 353-358 :2944-2947
[29]   Ball grid array technology [J].
Anon .
EDN, 1997, 42 (16 A) :23-24
[30]   Ball grid array soldering [J].
Khan, Zulki .
Assembly, 2008, 51 (02) :26-31