Integrated life prediction method of ball grid array soldered joint

被引:0
作者
Chen, Ying [1 ]
Kang, Rui [1 ]
机构
[1] Department of System Engineering of Engineering Technology, Beijing University of Aeronautics and Astronautics, Beijing 100191, China
来源
Hanjie Xuebao/Transactions of the China Welding Institution | 2009年 / 30卷 / 11期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:105 / 108
相关论文
共 50 条
[1]   Life prediction of ball grid array soldered joints under thermal cycling loading by fracture mechanics method [J].
Fang, H.Y. ;
Wang, L. ;
Qian, Y.Y. .
Journal of Materials Science and Technology, 2001, 17 (01) :165-166
[2]   Life Prediction of Ball Grid Array Soldered Joints under Thermal Cycling Loading by Fracture Mechanics Method [J].
Hongyuan FANG ;
Li WANG and Yiyu QIAN National Key Laboratory of Advanced Welding Production Technology .
JournalofMaterialsScience&Technology, 2001, (01) :165-166
[3]   Life prediction of ball grid array soldered joints under thermal cycling loading by fracture mechanics method [J].
Fang, HY ;
Wang, L ;
Qiang, YY .
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2001, 17 (01) :165-166
[4]   Enhancing solder joint fatigue life for ball grid array packages [J].
Wei, Z ;
Kuan, LB .
PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, :701-706
[5]   Warpage prediction of ball grid array package with the homogenization method [J].
Suzuki, Tomohisa ;
Terasaki, Takeshi ;
Tanaka, Toshiaki ;
Takekoshi, Masaaki .
Journal of Japan Institute of Electronics Packaging, 2013, 16 (01) :70-76
[6]   Analytical Fatigue Life Prediction of Ball Grid Array Solder Joints [J].
Tinca, Iulia-Eliza ;
Davidescu, Arjana .
JOURNAL OF ELECTRONIC MATERIALS, 2023, 52 (12) :7991-8000
[7]   Analytical Fatigue Life Prediction of Ball Grid Array Solder Joints [J].
Iulia–Eliza Ţinca ;
Arjana Davidescu .
Journal of Electronic Materials, 2023, 52 :7991-8000
[8]   Warpage prediction of ball grid array packaging [J].
Kim, Yeong K. ;
Peak, Russell ;
Zwemer, Dirk .
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2007, VOL 5: ELECTRONICS AND PHOTONICS, 2008, :257-261
[9]   Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages [J].
Perkins, Andy ;
Sitaraman, Suresh K. .
MICROELECTRONICS RELIABILITY, 2007, 47 (12) :2260-2274
[10]   Thermal fatigue life prediction of solder joints of plastic ball grid array packages [J].
Chu, Yin Fun ;
Yi, Sung ;
Geng, Phil .
International Journal of Materials and Structural Integrity, 2014, 8 (1-3) :3-20