Prediction of brittle-to-ductile transition depth in ultra-precision grinding YAG crystals

被引：0

作者：

Ao M. ^{[1
]}

Huang J. ^{[1
]}

Zeng Y. ^{[2
]}

Wu Y. ^{[2
]}

Kang R. ^{[1
]}

Gao S. ^{[1
]}

机构：

[1] State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian

[2] Institute of Manufacturing Engineering, Huaqiao University, Xiamen

来源：

Guangxue Jingmi Gongcheng/Optics and Precision Engineering | 2024年 / 01期

关键词：

brittle-to-ductile transition; nano-indentation; nano-scratch; ultra-precision grinding; YAG crystal;

D O I：

10.37188/OPE.20243201.0084

中图分类号：

学科分类号：

摘要：

Yttrium aluminum garnet（YAG）crystals are widely used for manufacturing solid-state lasers，and ultraprecision grinding is critical for machining hard and brittle material parts，such as YAG crystals. The investigation of microdeformation and brittle-to-ductile transition mechanisms of hard and brittle material-machined surfaces is necessary for ultraprecision grinding. Based on the elastic-plastic contact theory and indentation fracture mechanics，a model for predicting the critical depth of brittle-to-ductile transitions was established to achieve low-damage grinding of YAG crystals and obtain high-quality surfaces. The deformation process of the material surface under the action of a single abrasive scratch was analyzed，considering the elastic recovery of the material and the size effect of micromechanical properties. The critical depth of the brittle-to-ductile transition of the YAG crystal is 66. 7 nm. The proposed prediction model of the critical depth of the brittle-to-ductile transition was verified by ultraprecision grinding of YAG crystals with grinding wheels of different grain sizes. In addition，the grit-cutting depths of different grain-size grinding wheels under the corresponding process conditions were calculated. The results show that when the grit-cutting depth is more extended than the critical depth of the brittle-to-ductile transition，the surface material of the YAG crystal is removed in a brittle manner，and the grinding surface is severely damaged. However，when the grit-cutting depth is less than the critical depth of the brittle-to-ductile transition，the grinding surface material is removed in a ductile manner，high-quality grinding surface can be obtained，and the machined surface roughness can reach 1 nm. The proposed model for predicting the critical depth of the brittle-to-ductile transition provides theoretical guidance for low-damage ultraprecision grinding of YAG crystals. © 2024 Chinese Academy of Sciences. All rights reserved.

引用

页码：84 / 94

页数：10

共 38 条

[1] WU Y., Solid-state single-crystal growth of YAG and Nd∶YAG by spark plasma sintering［J］, Journal of Materials Science & Technology, 106, pp. 118-127, (2022)
[2] ZHANG C G，, Et al., Transparent YAG ceramic/sapphire composite fabricated by pressureless direct thermal diffusion bonding［J］, Journal of the European Ceramic Society, 41, 15, pp. 7845-7851, (2021)
[3] AGNESI A., Jitter investigation of narrow-bandwidth passively Q-switched Nd：YAG unidirectional ring laser［J］, Optics Letters, 44, 12, pp. 3094-3097, (2019)
[4] TUTUNEA-FATAN O R., Performance of laser polishing in finishing of metallic surfaces［J］, The International Journal of Advanced Manufacturing Technology, 73, 1/2/3/4, pp. 35-52, (2014)
[5] SACHDEVA A, PICKERING E M, LEE H J., From electrocautery，balloon dilatation，neodymium-doped：yttrium-aluminum-garnet（Nd∶YAG）laser to argon plasma coagulation and cryotherapy［J］, Journal of Thoracic Disease, 7, pp. S363-S379, (2015)
[6] PALMA A L，, DI CARLO A, Et al., Laser processing in the manufacture of dye-sensitized and perovskite solar cell technologies［J］, ChemElectroChem, 3, 1, pp. 9-30, (2016)
[7] WEI CH, YAN R P，, LI X D, Et al., Research progress of sub-nanosecond lasers for 3D imaging lidar［J］, Opt. Precision Eng, 29, 6, pp. 1270-1280, (2021)
[8] ROSS D，, YAMAGUCHI H., Nanometer-scale characteristics of polycrystalline YAG ceramic polishing［J］, CIRP Annals, 67, 1, pp. 349-352, (2018)
[9] MCKAY J, BAI T Y，, GOORSKY M S., Chemical mechanical polishing and direct bonding of YAG ［J］, ECS Transactions, 86, 5, pp. 217-222, (2018)
[10] LIU J., Grinding of silicon wafers：a review from historical perspectives［J］, International Journal of Machine Tools and Manufacture, 48, 12, pp. 1297-1307, (2008)

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