Application of contact theory to metal-metal bonding of silicon wafers

被引：0

作者：

Leong, H.L. ^{[2
]}

Gan, C.L. ^{[1
]}

Thompson, C.V. ^{[3
,6
]}

Pey, K.L. ^{[4
,6
]}

Li, H.Y. ^{[5
]}

机构：

[1] School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore

[2] Advanced Materials for Micro- and Nano-Systems, Singapore-MIT Alliance, 4 Engineering Drive 3, Singapore 117576, Singapore

[3] Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, United States

[4] School of Electrical and Electronics Engineering, Nanyang Technological University, Singapore 639798, Singapore

[5] Institute of Microelectronics, Singapore Science Park II, 11 Science Park Road, Singapore 117685, Singapore

[6] Advanced Materials for Micro and Nano-Systems, Singapore-MIT Alliance, 4 Engineering Drive 3, Singapore 117576, Singapore

来源：

Journal of Applied Physics | 2007年 / 102卷 / 10期

关键词：

31;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Journal article (JA)

引用

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