Application of contact theory to metal-metal bonding of silicon wafers

被引：0
|
作者：
Leong, H.L. [2 ]
Gan, C.L. [1 ]
Thompson, C.V. [3 ,6 ]
Pey, K.L. [4 ,6 ]
Li, H.Y. [5 ]
机构：
[1] School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
[2] Advanced Materials for Micro- and Nano-Systems, Singapore-MIT Alliance, 4 Engineering Drive 3, Singapore 117576, Singapore
[3] Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, United States
[4] School of Electrical and Electronics Engineering, Nanyang Technological University, Singapore 639798, Singapore
[5] Institute of Microelectronics, Singapore Science Park II, 11 Science Park Road, Singapore 117685, Singapore
[6] Advanced Materials for Micro and Nano-Systems, Singapore-MIT Alliance, 4 Engineering Drive 3, Singapore 117576, Singapore
来源：
Journal of Applied Physics | 2007年 / 102卷 / 10期
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摘要：
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