Effect of Trace Mg Addition on Precipitation Behavior and Properties of Cu-Cr Alloy

被引:0
作者
Wu S. [1 ]
Wang J. [1 ]
Zhong S. [1 ]
Zhang J. [2 ]
Wang H. [2 ]
Yang B. [1 ,2 ]
机构
[1] School of Material Science and Engineering, Jiangxi University of Science and Technology, Ganzhou
[2] Institute of Engineering Research, Jiangxi University of Science and Technology, Ganzhou
来源
Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research | 2019年 / 33卷 / 07期
基金
中国国家自然科学基金;
关键词
Aging strengthening; Cu-Cr system alloy; Metallic materials; Microstructure; Softening resistance;
D O I
10.11901/1005.3093.2018.596
中图分类号
学科分类号
摘要
Cu-Cr and Cu-Cr-Mg alloys were prepared by melting and casting process, then the effect of Mg addition on hardness, electrical properties and softening resistance of the alloys was assessed. The results show that after aging treatment, the hardness and softening temperature of the Cu- Cr-Mg alloy are higher than that of the Cu-Cr binary alloy, while the high electrical conductivity is maintained. The main strengthening mechanism of these two alloys is aging precipitation strengthening. The addition of Mg inhibits the growth and structural transformation of the nano-precipitates. The strengthening phase of the peak-aged Cu-Cr-Mg alloy still maintains a coherent interface with the matrix. The precipitate with the similar structure as Heulser phase is observed in the over-aging alloy. After post heat treatment of the peak-aged alloys, the size of the strengthening phase of Cu-Cr-Mg alloy is significantly smaller than that of the Cu-Cr alloy. Mg and Cr coexist in the precipitate at the early stage of aging, while in the later stage of aging, only Cr exists inside the precipitate. The theoretical estimation results show that Mg can significantly reduce the interfacial energy between Cu (fcc) and Cr (bcc), leading to segregation of Mg at the interface matrix/precipitate. This may be the main reason why Mg can refine the precipitates and improve the performance of the Cu-Cr alloy. © All right reserved.
引用
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页码:552 / 560
页数:8
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