Effect of SiCp electroless plating on the microstructure and thermal properties of SiCp/Al composites

被引：0
作者：
机构：
[1] School of Materials Science and Engineering, Nanchang Hangkong University, Nanchang
[2] Key Laboratory of Nondestructive Testing (Nanchang Hangkong University), Ministry of Education, Nanchang
来源：
Li, Duosheng (ldscad@163.com) | 2015年 / Journal of Functional Materials卷 / 46期
关键词：
Electroless plating; Interface; Microstructure; SiCp/Al composites; Thermal conductivity;
D O I：
10.3969/j.issn.1001-9731.2015.18.019
中图分类号：
学科分类号：
摘要：
In order to improve the interface of between SiC particles and Al matrix, under alkaline condition, the surface of SiC particles was plated with Cu using electroless plating. Then SiCp/Al composites were prepared by pressureless infiltration technology. Surface and interface morphology, microstructure and phase of SiC particle and SiCp/Al composites were analyzed by X-ray diffraction, 3D stereo video microscope and scanning electron microscope respectively. The surface element of SiC particles coating and composites was analyzed by EDS, meantime, thermal conductivity of SiCp/Al composites was measured by the laser flash method. The results show that, compared with a single KNaC4H4O6·4H2O complexant, double complexants (KNaC4H4O6·4H2O+EDTA-2Na) can more effectively plate a dense, no oxidation and good combined interface Cu coating on the surface of SiCp. The interface thickness of Cu was approximatively 2.5-3 μm. AlCu2 phase was detected in the interface, however Al4C3 brittle phase was not found. The thermal conductivity of SiCp/Al composites was 181 W/(m·K) at 20 ℃. It was much higher than that (102 W/(m·K)) of SiCp/Al composites without surface modification of SiCp. © 2015, Journal of Functional Materials. All right reserved.
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页码：18092 / 18096
页数：4
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