Evolution of microstructure and mechanical properties in TiBw/Ti65 composites during vacuum solid-phase diffusion bonding

This paper examines the solid-phase diffusion bonding (DB) of TiBw/Ti65 composites, focusing on the effects of processing parameters such as temperature, time, pressure, and interlayer thickness. The findings show that lower processing conditions resulted in slower atomic diffusion and more defects, whereas higher conditions reduced pores but led to grain growth. Optimal bonding was achieved at 950 degrees C, 10 MPa, and 60 minutes, yielding a shear strength of 686 MPa, which is 81.86 % of the base material's strength. The introduction of pure titanium interlayer results in a concentration gradient, which serves as an additional driving force for atomic diffusion, thereby enhancing the quality of diffusion bonding. Shear strength varied with interlayer thickness, peaking at 668 MPa for a 5 mu m interlayer. Microplastic deformation, dynamic recrystallization (DRX), and grain boundary (GB) migration affected the microstructure and mechanical properties of the bonding interface. TiB whiskers (TiBw) near the bonding interface significantly influenced DRX and GB migration during the DB process.