Welcoming Message from Program Committee Chairs

被引:0
|
作者
Ren, Fuji
Ma, Huadong
Li, Xia
Pan, Jeng-Shyang
机构
来源
CCIS 2014 - Proceedings of 2014 IEEE 3rd International Conference on Cloud Computing and Intelligence Systems | 2014年
关键词
D O I
10.1109/CCIS.2014.7175835
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] Message from the Program Committee chairs
    Cotroneo, Domenico
    Di Flora, Cristiano
    International Workshop on System Support for Future Mobile Computing Applications, FUMCA 2006, 2006,
  • [42] Message from the program committee chairs
    Ikeda, Makoto
    Arakawa, Fumio
    IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVIII - Proceedings, 2015,
  • [43] Message from Program Committee Chairs
    Chen, Min
    Sousa, Leonel
    Tian, Yonghong
    Proceedings - 2015 IEEE International Symposium on Multimedia, ISM 2015, 2016,
  • [44] Message from Program Committee Chairs and General Chairs
    Proceedings - 2024 26th International Conference on Business Informatics, CBI 2024, 2024,
  • [45] Message from the general chairs and program committee chairs
    2016, Springer Verlag (9932 LNCS):
  • [46] Message from the Technical Program Committee Committee Chairs
    Fahmy, Sonia
    Li, Baochun
    Lui, John
    Mao, Shiwen
    Proceedings - IEEE INFOCOM, 2015, 26
  • [47] Message from the Technical Program Committee Chairs
    Silva-Cardenas, Carlos
    Rodriguez-Vazquez, Angel
    2019 IEEE 10th Latin American Symposium on Circuits and Systems, LASCAS 2019 - Proceedings, 2019,
  • [48] Welcome message from the program committee chairs
    1600, Institute of Electrical and Electronics Engineers Inc.
  • [49] Message from the Technical Program Committee Chairs
    Xiong, Jie
    Xiao, Fu
    Shangguan, Longfei
    Proceedings of the International Conference on Parallel and Distributed Systems - ICPADS, 2023, 2023-January
  • [50] Message from Technical Program Committee Chairs
    Xiong, Jinjun
    Wang, Chen
    Sangpetch, Orathai
    Proceedings of the International Conference on Cloud Computing Technology and Science, CloudCom, 2022, 2022-December