The changing economics of in-circuit test

Zero footprint and multisite design concepts are changing the economics of ICT (in-circuit test) in different ways for manufacturers of high-volume printed circuit board assemblies. A zero footprint concept allows installation of the electrical test components into standard size automation equipment without adding extra length to the assembly line. A multisite concept allows expansion of the electrical test throughput capacity of the ICT system without the need to add new test systems. In a typical in-line production environment, the dimension of width matters much more to the manufacturer and the automation equipment supplier than the dimensions of depth or height. Up to four ICT test modules, each with test instruments that are capable of simultaneously testing a single board, can be added to the system. Economies are achieved by sharing site resources where it is possible. Because multisite test systems have parallel test capabilities it is possible for them to test up to 4x faster than traditional ICT systems.