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- [41] Investigation on The Relationship between Fracture Toughness of Underfill and The Chemical State of Filler Surface at Different Temperatures 2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
- [47] Influence of Temperature from 20 to 100 °C on Specific Surface Energy and Fracture Toughness of Silicon Wafers DEVICES AND METHODS OF MEASUREMENTS, 2023, 14 (04): : 277 - 283