Behavior of whisker growth from the pure Sn coating under the temperature cycling condition

被引：0
|
作者：
Zhang, Jin-Song [1 ]
Li, Juan-Juan [1 ]
Wu, Feng-Shun [1 ]
Zhu, Yu-Chun [1 ]
An, Bing [1 ]
Wu, Yi-Ping [1 ]
机构：
[1] Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China
来源：
Gongneng Cailiao/Journal of Functional Materials | 2007年 / 38卷 / 11期
关键词：
13;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1837 / 1840
相关论文
共 50 条
  • [1] Relations between the chemical composition of Sn finish and Sn whisker growth under temperature cycling
    Zhang, Jinsong
    Zhu, Yuchun
    Li, Juanjuan
    Wu, Yiping
    Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition), 2008, 36 (03): : 24 - 27
  • [2] Mechanism of whisker growth on pure Sn coating of Cu leads in the high temperature/humidity storage tests
    Zhang, Jinsong
    Zhang, Jianhua
    FRONTIERS OF MANUFACTURING AND DESIGN SCIENCE, PTS 1-4, 2011, 44-47 : 2691 - +
  • [3] Sn whisker growth during thermal cycling
    Suganuma, Katsuaki
    Baated, Alongheng
    Kim, Keun-Soo
    Hamasaki, Kyoko
    Nemoto, Norio
    Nakagawa, Tsuyoshi
    Yamada, Toshiyuki
    ACTA MATERIALIA, 2011, 59 (19) : 7255 - 7267
  • [4] Effects of Annealing on Sn Whisker Formation Under Temperature Cycling and Isothermal Storage Conditions
    Lee, Hua-Xing
    Chan, Kah-Yoong
    Shakur, Mohd Hamdi Abdul
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (07): : 1110 - 1115
  • [5] Effect of Substrate Composition on Sn Whisker Growth in Pure Sn Films
    Miller, Sarah M.
    Sahaym, Uttara
    Norton, M. Grant
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2010, 41A (13): : 3386 - 3395
  • [6] Effect of Substrate Composition on Sn Whisker Growth in Pure Sn Films
    Sarah M. Miller
    Uttara Sahaym
    M. Grant Norton
    Metallurgical and Materials Transactions A, 2010, 41 : 3386 - 3395
  • [7] Whisker initiation behavior from electrodeposited Sn/Cu coating on Cu leadframe
    Kato, Takahiko
    Akahoshi, Haruo
    Terasaki, Takeshi
    Iwasaki, Tomio
    Nakamura, Masato
    Hashimoto, Tomoaki
    Nishimura, Asao
    PRICM 6: SIXTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-3, 2007, 561-565 : 1685 - +
  • [8] The behavior of Sn whisker growth on Sn-0.7Cu-0.05Ni solder joint during thermal cycling
    Hashim, Aimi Noorliyana
    Mohd Salleh, Mohd Arif Anuar
    Ramli, Muhammad Mahyiddin
    Al Bakri Abdullah, Mohd Mustafa
    Sandu, Andrei Victor
    Vizureanu, Petrica
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2024, 35 (32)
  • [9] Tin whisker growth under cycling current pulse
    Jiang, Bo
    Xian, Ai-Ping
    2006 CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP '06), PROCEEDINGS, 2006, : 27 - +
  • [10] Mitigation of whisker growth by improving the creep properties of Sn coating with bismuth
    Tian, Shuang
    Cao, Ruihua
    Fan, Qizhou
    Zhou, Xingxing
    Jia, Yongqiang
    Zhou, Jian
    Xue, Feng
    Sun, ZhengMing
    JOURNAL OF MATERIALS SCIENCE, 2021, 56 (30) : 17131 - 17145
12345