Evaluating strength of adhesive interface between metal and resin in resin-molded structures

被引：0

作者：

Yamazaki, Miki ^{[1
]}

Iwasaki, Tomio ^{[1
]}

机构：

[1] Hitachi Engineering Research Lab., Hitachi Ltd., Hitachinaka, Ibaraki 312-0034, 832-2, Horiguchi

来源：

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A | 2012年 / 78卷 / 790期

关键词：

Adhesive; Bonded Interface; Debonded Interface; Resin-Molded Structure; Surface Roughness;

D O I：

10.1299/kikaia.78.855

中图分类号：

学科分类号：

摘要：

For the stabilization of insulation performance in the resin-molded insulators, strong adhesion between the resin and metal is required. In this paper, influence of surface roughness for interfacial strength between the resin and metal was investigated. Test pieces were made by covering Cu and SUS cylinders, which have some values of surface roughness, with epoxy resin. The interfacial strength was evaluated with shearing tests of these test pieces. The effective adhesive surfaces of those cylinders were evaluated from surface observation with a laser microscope. The interfacial strength increased with surface roughness. The adhesion-strength index (μ+B), which had been proposed in previous paper, were calculated with the effective adhesive surface and the interfacial strength. The adhesion-strength index gave a constant value with various surface roughnesses for each metal. © 2012 The Japan Society of Mechanical Engineers.

引用

页码：855 / 864

页数：9

共 13 条

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