Interfacial structure and strength of Si3N4 ceramics joint brazed with amorphous filler metal and Cu layer

被引：0

作者：

Zou, Jiasheng ^{[1
]}

Zeng, Peng ^{[1
]}

Xu, Xiangping ^{[1
]}

机构：

[1] Provincial Key Lab. of Advanced Welding Technology, Jiangsu University of Science and Technology, Zhenjiang 212003, China

来源：

Hanjie Xuebao/Transactions of the China Welding Institution | 2012年 / 33卷 / 11期

关键词：

Ceramic materials - Diffusion bonding - Fillers - Brazing - Filler metals - Titanium nitride - Tin - Zirconium compounds - Copper compounds;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Si3N4 ceramics was brazed with TiZrCuB amorphous filler metal and Cu interlayer, the effect of brazing metal composition and thickness of copper foil on interfacial structure and bonding strength were studied in this paper. The result shows that the joint strength is up to 241 MPa when the brazing temperature is 1323 K, holding time is 30min, the thickness of Cu interlayer is 70 m and the exerted pressure is 0.027 MPa. the reaction layer is TiN, the interface microstructure is compounds of Si3N4/TiN/Ti-Si+Ti-Zr+Cu-Zr+α-Cu; changing the thickness of interlayer can adjust the thickness and composition of the reaction layer; As the thickness of Cu interlayer increases, Ti-Si compound layer has gradually separated from the TiN layer, and it is pushed to the weld center and refined to a granula shape.

引用

页码：47 / 50