Study on the critical conditions for ductile-brittle transition in ultrasonic-assisted grinding of SiC particle-reinforced Al-MMCs

High volume fraction (45 %) silicon carbide particle-reinforced aluminum matrix composites (SiCp/Al-MMCs) play a significant role in various engineering fields due to their outstanding performance. However, damages characterized by SiC particle fracture during machining lead to poor surface integrity, which severely affects the fatigue performance of SiCp/Al composite structural components. Ultrasonic-assisted grinding (UAG) is acknowledged as beneficial for promoting ductile grinding in hard and brittle materials. This study focuses on the critical conditions for ductile-brittle transition in ultrasonic-assisted grinding of SiCp/Al composites and develops a mechanism and data driven model of critical undeformed chip thickness (UCT) for ductile grinding to accurately predict the material removal mode. The model thoroughly integrates considerations of chip morphology, removal mode transition mechanism, and grinding surface damage characteristics. Response surface methodology (RSM) and genetic algorithms (GA) were utilized to correct the impact of processing parameters on the removal regime. Experiments on ultrasonic-assisted side and end grinding were conducted to thoroughly discuss the effects of different undeformed chip thicknesses, grinding speeds and ultrasonic vibration amplitude on surface damage and the critical conditions for the ductile-brittle transition. The findings corroborate the experimental data with the predicted values. Ultrasonic vibration can effectively reduce the brittle fracture of SiC particles in SiCp/Al composites. Appropriately increasing the grinding speed and reducing the chip thickness can enhance the critical chip thickness for ductile grinding and decrease the proportion of brittle surfaces, thereby achieving a balance between surface integrity and grinding efficiency. This research provides guidance for highperformance machining of SiCp/Al composites.