Evaluation of molded flip-chip BGA package for 28nm FPGA applications

As the FPGA device technology migrates to 28nm technology node and high-performance applications, selecting the right package to meet the customer usability requirements and to achieve product reliability goals becomes important. This paper describes the process used in selecting and qualifying the molded flip-chip BGA for cost effective, high-performance 28nm FPGA devices. A collaborative approach in partnership with the assembly manufacturer was employed to develop customer collateral that includes handling, reflow/rework and heatsink attach guidelines for the molded flip-chip BGA package. A detailed thermal modeling of the package was performed to characterize the thermal performance of the package. In addition, compressive loading characterization, component level and board level reliability tests were carried out to validate the long term reliability performance of the package in customer use conditions. The results of this study demonstrate that the molded flip-chip BGA package is a cost-effective, highreliability solution for 28nm FPGA devices.