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- [2] Effect of diluent on mechanical properties of DDM/E-51 epoxy resin system Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering, 2010, 26 (11): : 75 - 77
- [3] Structure adhesive of TDE-85/E-51 epoxy resin modified by polyurethane Gaofenzi Cailiao Kexue Yu Gongcheng, 2009, 8 (159-161+166):
- [4] Curing reaction of TDE-85/E-51 epoxy resin modified by polyurethane Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering, 2009, 25 (05): : 26 - 28
- [5] Investigation of the effect of graphite on microwave curing rates of E-51 epoxy resin systems Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica, 2013, 34 (12): : 2833 - 2840
- [6] Properties of E-51/DDS epoxy resin toughened by alkaline EPb-POSS Ma, Xiao-Yan (m_xiao_yana@nwpu.edu.cn), 2016, Beijing Institute of Aeronautical Materials (BIAM) (44): : 33 - 38
- [7] Photo-curing kinetics for CD-1012/E-51 epoxy resin system Cailiao Gongcheng/Journal of Materials Engineering, 2008, (05): : 43 - 47
- [9] The Preparation and Properties of the E-51 Epoxy Resin Modified by Epoxy-Terminated Hyperbranched Poly (Amine-Ester) PROCEEDINGS OF THE 7TH NATIONAL CONFERENCE ON CHINESE FUNCTIONAL MATERIALS AND APPLICATIONS (2010), VOLS 1-3, 2010, : 1037 - 1041
- [10] Study on the dynamic mechanical behavior of epoxy E-51/DDM system modified with mesogenic compound Lizi Jiaohuan Yu Xifu/Ion Exchange and Adsorption, 2001, 17 (04):