Fracture Properties Characterization of Multi-Layer Ceramic Capacitors for Device Longevity Assessment

被引：0

作者：

Lee, Po-Yi ^{[1
]}

Chen, Kuo-Shen ^{[1
]}

Chiu, Tz-Cheng ^{[1
]}

Yang, Tian-Shiang ^{[1
]}

Ho, Ching-Jenq ^{[1
]}

Chen, Lien-Wen ^{[1
]}

机构：

[1] National Cheng-Kung University, Mechanical Engineering Department, Tainan,70101, Taiwan

来源：

2024 International Conference on Electronics Packaging, ICEP 2024 | 2024年

关键词：

Circuit boards - Fracture property - Indentation test - Laminated structures - Multi-layer ceramic capacitor - Multilayer ceramic capacitors - Passive elements - Property characterizations - Thermo-mechanical;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：285 / 286