Interconnection evaluation technology for printed wiring boards

As a developer of world-class products including server and network devices, Fujitsu recognizes the printed wiring board (PWB) as a core component among the various components of those products. One basic element supporting high-quality PWBs is through-hole interconnection reliability. Existing methods for evaluating interconnections typically involve temperature cycle tests that subject the PWB to low and high temperatures. We have developed an evaluation technique that applies current to interconnections and wiring patterns to heat the PWB's interior and generate a temperature rise. This technique can apply a temperature load closer to actual conditions than temperature cycle tests can, enabling evaluation in one-fifth the time. In this paper, we introduce this new through-hole interconnection evaluation technique.