Hydrophilicity of polyimide surface-modified by plasma bombardment

被引：0

作者：

Ma, Jin ^{[1
]}

Wu, Chenguo ^{[1
]}

Wu, Peixuan ^{[1
]}

Wang, Sanpo ^{[1
]}

Shen, Jie ^{[1
]}

机构：

[1] Dept. of Materials Science, Fudan University

来源：

Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology | 2009年 / 29卷 / 06期

关键词：

Hydrophilicity; Peel strength; Plasma; Polyimide; Surface modification;

D O I：

10.3969/j.issn.1672-7126.2009.06.14

中图分类号：

学科分类号：

摘要：

A novel technique was developed to improve the hydrophilicity of polyimide surface and to enhance its interfacial adhesion to Cu film. In the technique, polyimide surfaces were modified by plasma bombardment. The impacts of the surface modification conditions, including type of plasma, bombardment current, time and pressure, on its hydrophilicity were studied. In addition, the Cu films were deposited on the surface modified polyimide substrate. The results show that plasma surface modification significantly improves its hydrophilicity and its interfacial adhesion. Interesting finding is that the higher the hydrophilicity, the stronger the interfacial adhesion. We suggest that a judicious choice of plasma surface modification conditions may lead to an optimized hydrophilicity.

引用

页码：664 / 668

页数：4

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