Thermal stress induced composite laminate delamination analysis and experiment verification

被引：0
|
作者：
Ran, Zhiguo [1 ]
Yan, Ying [1 ]
Li, Jianfeng [1 ]
Cong, Qiang [2 ]
Chen, Haifeng [2 ]
Kuang, Naihang [3 ]
机构：
[1] School of Aeronautic Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100191, China
[2] Lab. of Mechanical Engineering, China Academy of Space Technology, Beijing 100194, China
[3] Harbin FRP Institute, Harbin 150036, China
来源：
Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics | 2014年 / 40卷 / 06期
关键词：
Thermal expansion - Reliability analysis - Thermal stress - Delamination - Temperature;
D O I：
10.13700/j.bh.1001-5965.2013.0485
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：819 / 823
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